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eLibrary > BS EN IEC 60115-8:2026+A11:2026 Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors >

BS EN IEC 60115-8:2026+A11:2026 Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors, 2026

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English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, product technologies and product classification [Go to Page]
3.1 Terms and definitions
3.2 Product technologies
3.3 Product classification
4 Preferred characteristics [Go to Page]
4.1 General
4.2 Style and dimensions [Go to Page]
4.2.1 Preferred styles and outline dimensions for rectangular (RR) resistors
Figures [Go to Page]
Figure 1 – Shape and dimension of rectangular (RR) resistors [Go to Page]
4.2.2 Preferred styles and outline dimensions for transverse (RT) resistors
Figure 2 – Shape and dimension of transverse (RT) resistors
Tables [Go to Page]
Table 1 – Preferred styles of rectangular (RR) resistors [Go to Page]
4.2.3 Preferred styles and outline dimensions for cylindrical (RC) resistors
Figure 3 – Shape and dimension of cylindrical (RC) resistors
Table 2 – Preferred styles of transverse (RT) resistors [Go to Page]
4.2.4 Preferred styles and outline dimensions for wire-wound (RW) resistors
Figure 4 – Shape and dimension of wire-wound (RW) resistors
Table 3 – Preferred styles of cylindrical (RC) resistors
Table 4 – Preferred styles of wire-wound (RW) resistors
4.3 Preferred climatic categories
4.4 Resistance
4.5 Tolerances on resistance
4.6 Rated dissipation P70
4.7 Limiting element voltage Umax
4.8 Insulation voltage Uins
4.9 Insulation resistance Rins
5 Tests and test severities [Go to Page]
5.1 General provisions for tests invoked by this document
Figure 5 – Derating curve based on ambient temperature
5.2 Preparation of specimens [Go to Page]
5.2.1 Drying
5.2.2 Mounting of components on test boards
Figure 6 – Basic appearance of recommended test board
Figure 7 – Basic layout for mechanical, environmental and electrical tests,Kelvin (4 point) connections
Figure 8 – Attachment of the sense line for Kelvin (4-point) connections for specimens with nominal resistance lower than 100 mΩ
Table 5 – Test board dimensions for RR resistors
Table 6 – Test board dimensions for RT resistors
Table 7 – Test board dimensions for RC resistors
5.3 Tests [Go to Page]
5.3.1 Resistance
5.3.2 Temperature coefficient of resistance
Figure 9 – Basic layout for mechanical, environmental and electrical tests [Go to Page]
5.3.3 Temperature rise
5.3.4 Endurance at the rated temperature 70 °C
5.3.5 Endurance at a maximum temperature: UCT
5.3.6 Short-term overload
5.3.7 Single-pulse high-voltage overload test
5.3.8 Periodic-pulse high-voltage overload test
5.3.9 Electrostatic discharge (ESD) test
5.3.10 Visual examination
5.3.11 Gauging of dimensions
Table 8 – Preferred aggravated overload conditions [Go to Page]
5.3.12 Detail dimensions
5.3.13 Shear (adhesion) test
5.3.14 Substrate bending test
Table 9 – Shear test force [Go to Page]
5.3.15 Shock
5.3.16 Vibration
5.3.17 Rapid change of temperature
5.3.18 Rapid change of temperature, ≥ 100 cycles
5.3.19 Climatic sequence
5.3.20 Damp heat, steady state
5.3.21 Solderability, with lead-free solder
5.3.22 Solderability, with SnPb solder
5.3.23 Resistance to soldering heat
5.3.24 Solvent resistance
5.3.25 Insulation resistance
5.3.26 Voltage proof
5.3.27 Flammability test
5.4 Optional and/or additional tests [Go to Page]
5.4.1 Single-pulse high-voltage overload test
5.4.2 Periodic-pulse overload test
5.4.3 Operation at low temperature
5.4.4 Damp heat, steady state, accelerated
6 Performance requirements [Go to Page]
6.1 General
6.2 Limits for change of resistance at tests
Table 10 – Limits for the change of resistance at tests
6.3 Temperature coefficient of resistance
6.4 Temperature rise
Table 11 – Permitted change of resistance due to the variation of temperature
6.5 Visual examination [Go to Page]
6.5.1 General visual criteria
6.5.2 Visual criteria after tests
6.5.3 Visual criteria for the packaging
6.6 Solderability
6.7 Insulation resistance
6.8 Flammability
7 Marking, packaging and ordering information [Go to Page]
7.1 Marking of the component
7.2 Packaging
7.3 Marking of the packaging
7.4 Ordering information
8 Detail specifications [Go to Page]
8.1 General
8.2 Information to be specified in a detail specification [Go to Page]
8.2.1 Outline drawing or illustration
8.2.2 Style and dimensions
8.2.3 Climatic category
8.2.4 Resistance range
8.2.5 Tolerances on resistance
8.2.6 Rated dissipation P70
8.2.7 Limiting element voltage Umax
8.2.8 Insulation voltage Uins
8.2.9 Insulation resistance Rins
8.2.10 Test severities
8.2.11 Limits of resistance change after testing
8.2.12 Temperature coefficient of resistance
8.2.13 Marking
8.2.14 Ordering information
8.2.15 Mounting
8.2.16 Storage
8.2.17 Transportation
8.2.18 Additional information
8.2.19 Quality assessment procedures
8.2.20 0 Ω Resistors
9 Quality assessment procedures [Go to Page]
9.1 General
9.2 Definitions [Go to Page]
9.2.1 Primary stage of manufacture
9.2.2 Structurally similar components
9.2.3 Assessment level EZ
9.3 Formation of inspection lots
9.4 Approved component (IECQ AC) procedures
9.5 Qualification approval (QA) procedures [Go to Page]
9.5.1 General
9.5.2 Qualification approval
9.5.3 Quality conformance inspection
9.6 Capability certification (IECQ AC-C) procedures
9.7 Technology certification (IECQ-AC-TC) procedures
9.8 Periodical evaluation of termination plating
9.9 Delayed delivery
9.10 Certified test records
9.11 Certificate of conformity (CoC)
Table 12 – Test schedule for the qualification approval
Table 13 – Test schedule for the quality conformance inspections
Annex A (normative)Symbols and abbreviated terms [Go to Page]
A.1 Symbols
A.2 Abbreviated terms
Annex B (normative)Visual examination criteria [Go to Page]
B.1 General
B.2 Criteria for general visual examination of body of specimens
Table B.1 – Visual examination criteria of body of specimen
B.3 Criteria for general visual examination of electrode of specimen
B.4 Criteria for general visual examination of marking of specimen
Table B.2 – Visual examination criteria of electrode of specimen
B.5 Criteria for packaging
Table B.3 – Visual examination criteria of marking of specimen
Annex C (informative)Workmanship requirements for the assembly of SMD resistors [Go to Page]
C.1 General
C.2 Out of alignment from solder pad
Table C.1 – Acceptable and non-acceptable mounting alignment
C.3 Formation of fillet [Go to Page]
C.3.1 Function of the fillet
C.3.2 Rectangular (RR) and transverse (RT) resistors
C.3.3 Cylindrical (RC) resistors
Table C.2 – Fillet of RR and RT resistors
C.4 Thickness of solder paste between the pad and electrode
Table C.3 – Fillet of RC resistors
C.5 Solder ball
Table C.4 – Thickness of solder paste between the pad and electrode
Table C.5 – Solder ball
Annex D (normative)0 Ω resistors (jumpers) [Go to Page]
D.1 General
D.2 Preferred characteristics
D.3 Tests and test severities
D.4 Performance requirements
D.5 Marking, packaging and ordering information
D.6 Detail specification
D.7 Quality assessment procedures
Annex E (informative)Guidance on the application of optional and/or additional tests [Go to Page]
E.1 General
E.2 Single-pulse high-voltage overload test
Table E.1 – Implementation of the single-pulse high-voltage overload test
E.3 Periodic-pulse overload test
E.4 Operation at low temperature
Table E.2 – Implementation of the periodic-pulse overload test
E.5 Damp heat, steady state, accelerated
Table E.3 – Implementation of the operation at low temperature test
Table E.4 – Implementation of the test damp heat, steady state, accelerated
Annex F (informative)Temperature rise of recommended test boards in the endurance testat the rated temperature 70 °C [Go to Page]
F.1 General
F.2 Position of the indicated resistor temperature in the endurance test at the rated temperature 70 °C [Go to Page]
F.2.1 Simulation model
Figure F.1 – Simulation model
Table F.1 – Simulation model dimensions [Go to Page]
F.2.2 Simulation result
Table F.2 – Physical property values used in simulation [Go to Page]
F.2.3 Position suitable for determining the resistor temperature at endurance at the rated temperature 70 °C
F.3 Applied power of each recommended test board and temperature rise at endurance test at the rated temperature 70 °C [Go to Page]
F.3.1 Precautions
Figure F.2 – Simulation result [Go to Page]
F.3.2 Data of temperature rise for RR resistors (simulation)
Figure F.3 – Load reduction curve with terminal part temperature as x-axis
Figure F.4 – RR0402M relationship between power and temperature at 70 °C
Figure F.5 – RR0603M relationship between power and temperature at 70 °C
Figure F.6 – RR1005M relationship between power and temperature at 70 °C
Figure F.7 – RR1608M relationship between power and temperature at 70 °C
Figure F.8 – RR2012M relationship between power and temperature at 70 °C
Figure F.9 – RR3216M relationship between power and temperature at 70 °C
Figure F.10 – RR3225M relationship between power and temperature at 70 °C
Figure F.11 – RR4532M relationship between power and temperature at 70 °C
Figure F.12 – RR5025M relationship between power and temperature at 70 °C [Go to Page]
F.3.3 Data of temperature rise for RT resistors (simulation)
Figure F.13 – RR6332M relationship between power and temperature at 70 °C
Figure F.14 – RT0510M relationship between power and temperature at 70 °C
Figure F.15 – RT0816M relationship between power and temperature at 70 °C
Figure F.16 – RT1220M relationship between power and temperature at 70 °C
Figure F.17 – RT1632M relationship between power and temperature at 70 °C
Figure F.18 – RT3245M relationship between power and temperature at 70 °C
Figure F.19 – RT2550M relationship between power and temperature at 70 °C
Figure F.20 – RT3263M relationship between power and temperature at 70 °C [Go to Page]
F.3.4 Data of temperature rise for RC resistors (Simulation)
Figure F.21 – RC1610M relationship between power and temperature at 70 °C
Figure F.22 – RC2012M, RC2211M relationship between power and temperature at 70 °C
F.4 Ideal number of specimens to mount on each test board [Go to Page]
F.4.1 General
F.4.2 Variation of temperature within the test board
Figure F.23 – RC3514M, RC3715M relationship between power and temperature at 70 °C
Figure F.24 – RC5922M, RC6123M relationship between power and temperature at 70 °C
Figure F.25 – Recommended test board for RR3216M mounted with 19 specimens
Figure F.26 – Temperature variation depending on the number of specimens mounted
Annex G (informative)Reason for selecting test boards with extremely wide patternsfor high rated dissipation resistors [Go to Page]
G.1 General
G.2 Simulation example of recommended test board for RT3263M made to be equivalent to the usage condition
Figure G.1 – Simulation model of recommended test board
G.3 Temperature rise when there is no efficient cooling system
Figure G.2 – Simulation model of circuit board with high heat dissipation capability
G.4 Dimensions of recommended test board when further raise of rated dissipation is required
Figure G.3 – Simulation model of circuit board with low heat dissipation capability
Figure G.4 – Dimensions of recommended test board in Table G.1
Table G.1 – Dimensions of recommended test boards for raising the rated dissipation
Annex X (informative)Cross-references to the prior edition of this document [Go to Page]
Table X.1 – Cross references to clauses
Bibliography
BACK COVER WITH LINKS.pdf [Go to Page]
Foreword
Section 1 General [Go to Page]
1 Scope
2 Normative references
3 Terms, definitions, symbols and abbreviated terms [Go to Page]
3.1 Terms and definitions
3.2 Symbols
3.3 Abbreviated terms
Section 2 Fendering [Go to Page]
4 General principles [Go to Page]
4.1 Provision and overall design of fendering systems
Table 1 — Berth features to be taken into account in the design of the fendering system
Table 2 — Vessel features to be taken into account in the design of the fendering system
4.2 Selection and design of fenders
4.3 Vessel characteristics [Go to Page]
4.3.1 General
4.3.2 Vessels with bulbous bows
Figure 1 — Geometry of vessel with bulbous bow impacting the quay structure
4.3.3 Belting
4.4 Fender layout for berths and other locations [Go to Page]
4.4.1 General
Figure 2 — Hull and cope geometry at initial contact
Figure 3 — Approximation of bow radius
4.4.2 Continuous quays
4.4.3 Island berths
Figure 4 — Fender layout for three island berth
Figure 5 — Fender layout for five island berth
4.4.4 Lead-in jetties and lock entrances
4.5 Berthing procedure [Go to Page]
4.5.1 Alongside berthing
Figure 6 — Geometry of vessel approach to berth
4.5.2 Ferry and Ro-Ro berths
Figure 7 — Ferry and Ro‑Ro vessel berthing
4.6 Berthing reactions and load distribution [Go to Page]
4.6.1 General
4.6.2 Hull pressures
Table 3 — Guidance on hull pressure
4.6.3 Fender energy absorption and reaction due to parallel and angular berthing
Figure 8 — Hull and fender geometry at contact
4.7 Moored reactions
4.8 Moored vessels subject to wave action
5 Calculation of berthing energies [Go to Page]
5.1 Characteristic and design berthing energy
5.2 Calculation of characteristic berthing energies for alongside berthing [Go to Page]
5.2.1 General
5.2.2 Berthing velocities
5.2.3 Displacement
5.2.4 Hydrodynamic mass coefficient
5.2.5 Eccentricity coefficient
5.2.6 Softness coefficient
5.2.7 Berth configuration coefficient
5.3 Calculation of berthing energies for ferry and Ro-Ro berths [Go to Page]
5.3.1 Characteristic berthing velocities
5.3.2 Side fenders
5.3.3 End fenders
6 Selection of fenders and fender types [Go to Page]
6.1 General
6.2 Materials and workmanship
6.3 Fenders using moulded/wrapped/extruded elastomeric units [Go to Page]
6.3.1 Fender selection
6.3.2 Fender reactions for the design of fender support structures, fender panels and fender ancillary items
6.4 Torsion arm fenders
Figure 9 — Torsion arm fender
6.5 Pneumatic and foam-filled fenders [Go to Page]
6.5.1 Pneumatic fenders
6.5.2 Foam-filled fenders
6.6 Shear forces on fenders
Table 8 — Typical coefficients of friction of fender-facing materials in dry conditions
6.7 Mounting and suspension [Go to Page]
6.7.1 General
6.7.2 Fixings
6.7.3 Restraint chains
6.7.4 Suspension systems for fenders
6.8 Fender panels [Go to Page]
6.8.1 Geometry
6.8.2 Design
6.8.3 Fabrication
6.8.4 Maintenance
6.9 Fender spools [Go to Page]
6.9.1 Design
6.9.2 Fixings
6.9.3 Corrosion mitigation
6.9.4 Fabrication
6.9.5 Maintenance
6.10 Flexible dolphins [Go to Page]
6.10.1 Loadings
6.10.2 Design of flexible dolphin
6.10.3 Design deflections
6.10.4 Decks and berthing frames
6.10.5 Flexible dolphins with fenders
Figure 11 — Flexible dolphins
6.11 Traceability
Section 3 Mooring [Go to Page]
7 Principles of effective mooring [Go to Page]
7.1 General
7.2 Snap back
7.3 Mooring lines [Go to Page]
7.3.1 Breast lines
7.3.2 Spring lines
7.3.3 Head and stern lines and additional mooring lines
7.4 Mooring layouts [Go to Page]
7.4.1 General
7.4.2 Continuous quays
Figure 12 — Typical mooring pattern for continuous quay
7.4.3 Island or similar berths
Figure 13 — Optimum angles of mooring lines for island tanker berth
8 Actions acting on the moored vessel [Go to Page]
8.1 General
8.2 Wind and currents
8.3 Hydrodynamic forces [Go to Page]
8.3.1 Off‑quay hydrodynamic forces
Figure 14 — Vessel under influence of stand off force
8.3.2 Passing vessel effects
8.3.3 Long period and infragravity waves
8.4 Tidal rise and fall and change in draught or trim due to cargo operations
8.5 Ice
Figure 15 — Effect of rise and fall of tide and change in draught or trim
9 Loads on mooring points [Go to Page]
9.1 General
9.2 Calculation methods [Go to Page]
9.2.1 General
9.2.2 Method 1: Elastic analysis
9.2.3 Method 2: Simple shared loads
9.2.4 Method 3: Working line loads
9.2.5 Method 4: Computer simulation or physical modelling
9.2.6 Method 5: Notional bollard load capacity
Table 9 — Nominal bollard capacity for preliminary design of continuous berths accommodating vessels up to 20 000 t displacement
9.3 Design of mooring point supporting structures
10 Berth mooring equipment [Go to Page]
10.1 Materials and testing
10.2 Mounting and fixing
10.3 Traceability
10.4 Bollards
Table 10 — Mooring bollards
Table 11 — Partial factors associated with the uncertainty of the resistance model applicable to the design of bollards
10.5 Quick release mooring hooks
10.6 Capstans
10.7 Alternative mooring systems [Go to Page]
10.7.1 Hydraulic piston mooring systems
10.7.2 Vacuum mooring systems
10.7.3 Magnetic mooring systems
Annex A (normative)Performance testing of elastomeric fender units
A.1 Test pieces
A.2 Number of test pieces
A.3 Test laboratory and apparatus
A.4 Independent verification
A.5 Thermal stabilization
Table A.1 — Calculation of Δ for determining the duration of thermal stabilization
A.6 Compression velocity
A.7 Angular compression
A.8 Extent of compression
A.9 Calculation of energy absorption
A.10 Stability of test piece
A.11 Test procedure
A.12 Pass criteria
A.13 Test report
A.14 Establishment of fender performance factors
A.15 Performance testing for type approval
Annex B (informative)Berthing velocities
B.1 Historic approach
B.2 WG211 approach
B.3 Alternative approach
Figure B.1 — Suggested minimum berthing velocities
Table B.1 — Minimum characteristic berthing velocities
Annex C (normative)Durability testing of elastomeric fender units
C.1 Test pieces
C.2 Number of test pieces
C.3 Number and extent of compressions
C.4 Test laboratory and apparatus
C.5 Test procedure
C.6 Pass criteria
C.7 Test report
C.8 Durability testing for type approval
Annex D (informative)Further background to moored ship dynamic response
Annex E (normative)Numerical modelling
Figure E.1 — The six degrees of freedom of vessel motion
Annex F (normative)Physical modelling
Annex G (normative)Testing of mooring equipment
G.1 General
G.2 Laboratory testing [Go to Page]
G.2.1 General
G.2.2 Testing pass criteria
G.2.3 Minimum breaking load (MBL)
G.2.4 Verification of working load limit at project stage
G.3 Reporting of laboratory testing
G.4 Conformity
G.5 Verification of WLL of installed mooring equipment
G.6 Reporting of in situ testing
Bibliography [Go to Page]

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BS EN IEC 60115-8:2026+A11:2026 Fixed resistors for use in electronic equipment - Part 8: Sectional specification: Fixed surface mount resistors, 2026

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