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BS EN IEC 60749-22-1:2026 Semiconductor devices — Mechanical and climatic test methods - Bond strength — wire bond pull test methods, 2026
- undefined
- European foreword
- Endorsement notice
- Annex ZA (normative) Normative references to international publications with their corresponding European publications [Go to Page]
- CONTENTS
- FOREWORD
- 1 Scope
- 2 Normative references
- 3 Terms and definitions
- Figures [Go to Page]
- Figure 1 – Definition of midspan
- Figure 2 – Depiction of eight outliers, seven of which are outlier products
- 4 Apparatus and material [Go to Page]
- 4.1 Inspection equipment
- 4.2 Workholder
- 4.3 Wire bond pull equipment
- 4.4 Pulling hook
- 4.5 Bond pull clamp
- 5 Procedure [Go to Page]
- 5.1 Calibration
- 5.2 Visual examination of bonds to be tested after decapsulation [Go to Page]
- 5.2.1 Applicability
- Tables [Go to Page]
- Table 1 – Guidance for the minimum diameter of the pulling hook [Go to Page]
- 5.2.2 Bond pad examination and acceptability criteria for both aluminium and copper bond pad metallization
- 5.2.3 Examination and acceptability criteria for Cu and Ag wire and connections (all bonds)
- 5.3 Performing the wire bond pull test [Go to Page]
- 5.3.1 Wire bond pull test used
- 5.3.2 Hook pull method
- Figure 3 – Place hook under wire
- Figure 4 – Orientation of hook with respect to the wire (viewed from above)
- Figure 5 – Hook placement for wire pull test (WPT) for different types of wire bonds
- Figure 6 – Wires with low bond angles
- Figure 7 – Device with slots to allow for hook placement
- Figure 8 – Reverse "shingle" stack
- Figure 9 – Vertical stack of die of the same size
- Figure 10 – Hook placement for ball pull test (BPT) for different types of wire bonds [Go to Page]
- 5.3.3 Clamp pull method of single bond (cut wire)
- Figure 11 – Hook placement for stitch pull test (SPT) for different types of wire bonds
- Figure 12 – Examples of acceptable and unacceptable placement of clamp on wire
- 5.4 Examination of pulled wire bonds
- Figure 13 – Clamp placement for ball pull test
- Figure 14 – Clamp placement for stitch pull test
- 5.5 Wire bond pull failure codes [Go to Page]
- 5.5.1 Tabulation of codes
- Figure 15 – General description of wire bond pull failure codes for all bond types
- Figure 16 – Detailed pull failure codes for standard thermosonically bonded wires
- Figure 17 – Detailed pull failure codes for reverse thermosonically bonded wires
- Figure 18 – Detailed pull failure codes for die to die thermosonically bonded wires
- Figure 19 – Detailed pull failure codes for standard ultrasonically bonded wires
- Figure 20 – Detailed pull failure codes for die to die ultrasonically bonded wires
- Figure 21 – Detailed pull failure codes for substrate to substrate ultrasonically bonded wires [Go to Page]
- 5.5.2 Defining code 6 versus Code 7 for thermosonic stitch bonds
- Figure 22 – Detailed pull failure codes for multi-loop ultrasonically bonded wires / ribbons [Go to Page]
- 5.5.3 Discussion on the significance of failure codes
- Figure 23 – Location of breaks in the stitch neckdown region versus in the stitch bond
- 5.6 Wire bond pull data [Go to Page]
- 5.6.1 Recording wire bond pull data
- 5.6.2 Determining equivalent wire diameter for ribbon bonds
- 5.6.3 Effective pull force versus the actual force on a bond
- 6 Summary
- Annex A (informative) Guidance for performing pull testing on stacked bonds (reverse, security and others) [Go to Page]
- A.1 Reverse bonds
- Figure A.1 – Top view image of reverse bond
- Figure A.2 – Side view image of reverse bond
- Figure A.3 – Examples of different electrical connections made with reverse bonds
- A.2 Security bonds
- A.3 Other stacked bonds
- Figure A.4 – The bump of a security bond
- Figure A.5 – The ball bond of a security loop
- Figure A.6 – Example of another type of stacked bonds
- Annex B (informative) Guidance for performing decapsulation on devices prior to bond pull testing [Go to Page]
- B.1 Rationale
- B.2 Warning regarding ultrasonic cleaning of exposed wire bonds
- B.3 Concerns with decapsulation processes for devices with copper and silver wire bonds
- Figure B.1 – Images of copper ball bonds showing severe damage from etching process
- Figure B.2 – Comparison images showing degree of cu attack due to two different etchants
- B.4 Concern with undercutting bonds due to over etching of the silver plating on leadframes
- Figure B.3 – Copper wire stitch bond fully decapsulated using laser ablation
- Figure B.4 – Laser ablation damage
- Figure B.5 – Drawn, optical and SEM images of break where metallurgical bond begins
- Figure B.6 – Undercutting of stitch bond due to excessive etching of silver plating
- B.5 Techniques for assessing if excessive etching of ag plating has occurred
- Figure B.7 – Ag plating removed by the decapsulation process, underlying cu is visible
- Figure B.8 – Plated Ag visible in the area around the stitch bonds, cu only visible at edges
- B.6 Concern with decapsulating packages with stitch bonds on multiple planes
- Figure B.9 – Assessing if excessive etching of Ag plating has occurred
- B.7 Concern with not removing all encapsulation material around the bonded wire prior to pull testing
- Figure B.10 – SEM and optical image examples of a reasonable amount of remaining encapsulant material for pull testing of very low angle bonds
- Annex C (informative) Correlation between pull failure codes in this document versus pull failure codes in Mil-Std 883, Method 2011.9 [Go to Page]
- Figure C.1 – Pull failure code locations for this document and Mil-Std 883, Method 2011.9
- Table C.1 – Conversion from (new) this document pull codes to(old) Mil-Std 883, Method 2011.9
- Figure C.2 – Failure code diagram from Mil-Std 883, Method 2011.9
- Annex D (informative) Images to aid in determining appropriate failure codes [Go to Page]
- D.1 Ilustration of failure codes
- Table D.1 – Failure code illustrations
- D.2 Failure in deformed portion of wire above thermosonic stitch bond – Code 6
- Figure D.1 – Gold stitch bond (unencapsulated) before and after wire pull testing
- Figure D.2 – Examples of break occurring within the neckdown region
- D.3 Failure in thermosonic stitch bond – Code 7
- Figure D.3 – Copper stich bonds before and after wire pull testing
- Figure D.4 – SEM image of a break within the neckdown region of a gold stitch bond
- Figure D.5 – Break occurring within gold stitch bonds
- D.4 Additional guidance for breaks in thermosonic stitch bonds – Code 6 versus code 7
- Figure D.6 – Break occurring within neckdown region of copper stich bonds
- Figure D.7 – SEM images of where the breaks are designated code 7
- Figure D.8 – Gold stitch bond on a Ni/Au plated cu land on an organic substrate
- Figure D.9 – Images from construction analysis report of gold stitch bond
- Figure D.10 – Stitch bonds made with Pd coated Cu wire ona Ag plated Cu alloy leadframe
- Figure D.11 – Ag splash
- Figure D.12 – Gaps between Cu wire and NiPdAu plated leadframe
- Figure D.13 – Stitch bond made with Cu wire on a Ag plated Cu alloy leadframe
- Figure D.14 – Images from construction analysis report of stitch bond made with Cu wire on a Ag plated Cu alloy leadframe
- Annex E (informative) Additional guidance regarding minimum pull force specification values and process control requirements
- Annex F (informative) Factors that can affect wire pull outcome [Go to Page]
- F.1 Important factors
- Figure F.1 – Force diagram and detailed force equations 5.3.4 and 5.3.5 from NBS Technical note 726
- F.2 How bond angle affects pull force
- Figure F.2 – Pull force versus tension in wire, an example of very low bond angles
- F.3 Pull angle affects pull force and fail mode
- Figure F.3 – Various bond angles with respect to their bonding surfaces
- Table F.1 – Compensation for minimum pull force for various bond angles
- Figure F.4 – How pull angle affects tension
- Table F.2 – How pull angle affects force applied to each bond
- Annex G (informative) Background and reasons for choice of minimum pull specification values
- Bibliography [Go to Page]
