Already a subscriber? 
MADCAD.com Free Trial
Sign up for a 3 day free trial to explore the MADCAD.com interface, PLUS access the
2009 International Building Code to see how it all works.
If you like to setup a quick demo, let us know at support@madcad.com
or +1 800.798.9296 and we will be happy to schedule a webinar for you.
Security check
Please login to your personal account to use this feature.
Please login to your authorized staff account to use this feature.
Are you sure you want to empty the cart?
PD IEC TR 63162:2025 Electric components - Reliability - Failure rates at reference conditions, 2025
- undefined
- CONTENTS
- FOREWORD
- INTRODUCTION
- 1 Scope
- 2 Normative references
- 3 Terms, definitions and symbols [Go to Page]
- 3.1 Terms and definitions
- 3.2 Symbols
- 4 Context and conditions [Go to Page]
- 4.1 Failure modes and mechanisms
- 4.2 Thermal modelling
- 5 Reference conditions [Go to Page]
- 5.1 Generic reference conditions for environmental and mechanical stresses
- 5.2 Specific temperature reference conditions
- Tables [Go to Page]
- Table 1 – Recommended reference conditions for environmental stresses
- Table 2 – Values of environmental parameters for reference environment
- 5.3 Component types
- 5.4 Failure rates
- 6 Integrated semiconductor circuits [Go to Page]
- 6.1 Integrated circuits failure rate
- Table 3 – Memory failure rate in FIT
- Table 4 – Microprocessors and peripherals, microcontrollers and signal processors failure rate in FIT
- Table 5 – Digital logic families and bus interfaces, bus driver and receiver circuits failure rate in FIT
- Table 6 – Analog ICs failure rate in FIT
- 6.2 Voltage reference conditions for integrated circuits
- Table 7 – Application-specific ICs (ASICs) failure rate in FIT
- Table 8 – Voltage reference conditions for integrated circuits
- 7 Discrete semiconductors failure rate [Go to Page]
- Table 9 – Transistors common, low frequency, failure rate in FIT
- Table 10 – Transistors, microwave, (e.g. RF > 800 MHz) failure rate in FIT
- Table 11 – Diodes failure rate in FIT
- Table 12 – Power semiconductors failure rate in FIT
- 8 Optoelectronic components failure rate [Go to Page]
- Table 13 – Optoelectronic semiconductor signal receivers failure rate in FIT
- Table 14 – LEDs, IREDs, laser diodes and transmitter components failure rate in FIT
- Table 15 – Optocouplers and light barriers failure rate in FIT
- Table 16 – Passive optical components failure rate in FIT
- 9 Capacitors failure rate [Go to Page]
- Table 17 – Transceiver, transponder and optical sub-equipment failure rate in FIT
- Table 18 – Capacitors failure rate in FIT
- 10 Resistors and resistor networks failure rate
- 11 Inductors, transformers and coils failure rate [Go to Page]
- Table 19 – Resistors and resistor networks failure rate in FIT
- Table 20 – Inductors, transformers and coils failure rate in FIT
- 12 Microwave devices failure rate [Go to Page]
- Table 21 – Microwave devices failure rate in FIT
- 13 Other passive components failure rate
- 14 Electrical connections failure rate [Go to Page]
- Table 22 – Other passive components failure rate in FIT
- Table 23 – Electrical connections failure rate in FIT
- 15 Connectors and sockets failure rate
- 16 Relays failure rate [Go to Page]
- Table 24 – Connectors and sockets failure rate in FIT
- Table 25 – Relays failure rate in FIT
- 17 Switches and push-buttons failure rate
- 18 Signal and pilot lamps failure rate
- 19 Printed circuit boards (PCBs) [Go to Page]
- Table 26 – Switches and push-buttons failure rate in FIT
- Table 27 – Signal and pilot lamps failure rate in FIT
- Annex A (informative) Failure modes of components [Go to Page]
- Table A.1 – Failure modes: ICs (digital)
- Table A.2 – Failure modes: transistors, diodes, optocouplers
- Table A.3 – Failure modes: capacitors
- Table A.4 – Failure modes: resistors, inductive devices, relays
- Annex B (informative) Sources of reliability data [Go to Page]
- Table B.1 – Sources of reliability data
- Bibliography [Go to Page]
