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eLibrary > S+ IEC 60384-21 Ed. 3.0 en:2019 (Redline version) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 >

S+ IEC 60384-21 Ed. 3.0 en:2019 (Redline version) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1, 2019

S+ IEC 60384-21 Ed. 3.0 en:2019 (Redline version) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1, 2019

Redline version (English only) [Go to Page]
CONTENTS
FOREWORD
1 General
1 Scope
2 Normative references
3 Terms and definitions
4 Information to be given in a detail specification [Go to Page]
4.1 General
4.2 Outline drawing and dimensions
4.3 Mounting
4.4 Rating and characteristics [Go to Page]
4.4.1 General
4.4.2 Nominal capacitance range
4.4.3 Particular characteristics
4.4.4 Soldering
4.5 Marking
5 Marking [Go to Page]
5.1 General
5.2 Information for marking
5.3 Marking on the body
5.4 Requirements for marking
5.5 Marking of the packaging
5.6 Additional marking
6 Preferred ratings and characteristics [Go to Page]
6.1 Preferred characteristics
6.2 Preferred values of ratings [Go to Page]
6.2.1 Rated temperature (TR)
6.2.2 Rated voltage (UR)
6.2.3 Category voltage (UC)
6.2.4 Preferred values of nominal capacitance and associated tolerance values
6.2.5 Temperature coefficient (α)
6.2.6 Dimensions
7 Quality assessment procedures [Go to Page]
7.1 Primary stage of manufacture
7.2 Structurally similar components
7.3 Certified records of released lots
7.4 Qualification approval [Go to Page]
7.4.1 General
7.4.2 Qualification approval on the basis of the fixed sample size procedures
7.4.3 Tests
7.5 Quality conformance inspection [Go to Page]
7.5.1 Formation of inspection lots
7.5.2 Test schedule
7.5.3 Delayed delivery
7.5.4 Assessment levels
8 Test and measurement procedures [Go to Page]
8.1 General
8.2 Preliminary drying
8.3 Measuring conditions
8.4 Mounting
8.5 Visual examination and check of dimensions [Go to Page]
8.5.1 General
8.5.2 Visual examination
8.5.3 Requirements
8.6 Electrical tests [Go to Page]
8.6.1 Capacitance
8.6.2 Tangent of loss angle (tan δ )
8.6.3 Insulation resistance
8.6.4 Voltage proof
8.7 Temperature coefficient (α ) and temperature cycle drift [Go to Page]
8.7.1 General
8.7.2 Preliminary drying
8.7.3 Measuring conditions
8.7.4 Requirements
8.8 Shear test
8.9 Substrate bending test [Go to Page]
8.9.1 General
8.9.2 Initial measurement
8.9.3 Final inspection
8.10 Resistance to soldering heat [Go to Page]
8.10.1 General
8.10.2 Initial measurement
8.10.3 Test conditions
8.10.4 Recovery
8.10.5 Final inspection, measurements and requirements
8.11 Solderability [Go to Page]
8.11.1 General
8.11.2 Test conditions
8.11.3 Recovery
8.11.4 Final inspection, measurements and requirements
8.12 Rapid change of temperature [Go to Page]
8.12.1 General
8.12.2 Initial measurement
8.12.3 Number of cycles
8.12.4 Recovery
8.12.5 Final inspection, measurements and requirements
8.13 Climatic sequence [Go to Page]
8.13.1 General
8.13.2 Initial measurement
8.13.3 Dry heat
8.13.4 Damp heat, cyclic, Test Db, first cycle
8.13.5 Cold
8.13.6 Damp heat, cyclic, Test Db, remaining cycles
8.13.7 Final inspection, measurements and requirements
8.14 Damp heat, steady state [Go to Page]
8.14.1 General
8.14.2 Initial measurement
8.14.3 Test conditions
8.14.4 Recovery
8.14.5 Final inspection, measurements and requirements
8.15 Endurance [Go to Page]
8.15.1 General
8.15.2 Initial measurement
8.15.3 Test conditions
8.15.4 Recovery
8.15.5 Final inspection, measurements and requirements
8.16 Robustness of terminations (only for capacitors with strip termination) [Go to Page]
8.16.1 General
8.16.2 Test conditions
8.16.3 Final inspection and requirements
8.17 Component solvent resistance (if required)
8.18 Solvent resistance of the marking (if required)
8.19 Accelerated damp heat, steady state (if required) [Go to Page]
8.19.1 General
8.19.2 Initial measurement
8.19.3 Conditioning
8.19.4 Recovery
8.19.5 Final measurements
Annex A(normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Annex B (informative) Combination of temperature coefficient and tolerance for the reference temperature of 25 °C
Annex X (informative) Cross-reference for reference to IEC 60384-21:2011
Bibliography
Figures [Go to Page]
Figure 1 – Fault: crack or fissure
Figure 2 – Fault: crack or fissure
Figure 3 – Separation or delamination
Figure 4 – Exposed electrodes
Figure 5 – Principal faces
Figure 6 – Reflow temperature profile
Figure A.1 – Dimensions
Tables [Go to Page]
Table 1 – Preferred tolerances on nominal capacitance
Table 2 – Nominal temperature coefficient and tolerance
Table 3 – Combination of temperature coefficient and tolerance
Table 4 – Fixed sample size test plan for qualification approval – Assessment level EZ
Table 5 – Tests schedule for qualification approval
Table 6 – Lot-by-lot inspection
Table 7 – Periodic tests
Table 8 – Tangent of loss angle limits
Table 9 – Test voltages
Table 10 – Temperature cyclic drift limits
Table 11 – Reflow temperature profiles for Sn-Ag-Cu alloy
Table 12 – Maximum capacitance change
Table 13 – Maximum capacitance change
Table 14 – Number of damp heat cycles
Table 15 – Final inspection, measurements and requirements
Table 16 – Test conditions for damp heat, steady state
Table 17 – Final inspection, measurements and requirements
Table 18 – Endurance test conditions (UC = UR)
Table 19 – Endurance test conditions (UC ≠ UR)
Table 20 – Final inspection, measurements and requirements
Table 21 – Initial requirements
Table 22 – Conditioning
Table A.1 – Dimensions
Table B.1 – Combination of temperature coefficient and tolerance for the reference temperature of 25 °C
Table X.1 – Reference to IEC 60384-21 for clause/subclause
Table X.2 – Reference to IEC 60384-21 for figure/table
International standard (Bilingual) [Go to Page]
English [Go to Page]
CONTENTS
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Information to be given in a detail specification [Go to Page]
4.1 General
4.2 Outline drawing and dimensions
4.3 Mounting
4.4 Rating and characteristics [Go to Page]
4.4.1 General
4.4.2 Nominal capacitance range
4.4.3 Particular characteristics
4.4.4 Soldering
4.5 Marking
5 Marking [Go to Page]
5.1 General
5.2 Information for marking
5.3 Marking on the body
5.4 Requirements for marking
5.5 Marking of the packaging
5.6 Additional marking
6 Preferred ratings and characteristics [Go to Page]
6.1 Preferred characteristics
6.2 Preferred values of ratings [Go to Page]
6.2.1 Rated temperature (TR)
6.2.2 Rated voltage (UR)
6.2.3 Category voltage (UC)
6.2.4 Preferred values of nominal capacitance and associated tolerance values
6.2.5 Temperature coefficient (α )
6.2.6 Dimensions
7 Quality assessment procedures [Go to Page]
7.1 Primary stage of manufacture
7.2 Structurally similar components
7.3 Certified records of released lots
7.4 Qualification approval [Go to Page]
7.4.1 General
7.4.2 Qualification approval on the basis of the fixed sample size procedures
7.4.3 Tests
7.5 Quality conformance inspection [Go to Page]
7.5.1 Formation of inspection lots
7.5.2 Test schedule
7.5.3 Delayed delivery
7.5.4 Assessment levels
8 Test and measurement procedures [Go to Page]
8.1 General
8.2 Preliminary drying
8.3 Measuring conditions
8.4 Mounting
8.5 Visual examination and check of dimensions [Go to Page]
8.5.1 General
8.5.2 Visual examination
8.5.3 Requirements
8.6 Electrical tests [Go to Page]
8.6.1 Capacitance
8.6.2 Tangent of loss angle (tan δ )
8.6.3 Insulation resistance
8.6.4 Voltage proof
8.7 Temperature coefficient (α ) and temperature cycle drift [Go to Page]
8.7.1 General
8.7.2 Preliminary drying
8.7.3 Measuring conditions
8.7.4 Requirements
8.8 Shear test
8.9 Substrate bending test [Go to Page]
8.9.1 General
8.9.2 Initial measurement
8.9.3 Final inspection
8.10 Resistance to soldering heat [Go to Page]
8.10.1 General
8.10.2 Initial measurement
8.10.3 Test conditions
8.10.4 Recovery
8.10.5 Final inspection, measurements and requirements
8.11 Solderability [Go to Page]
8.11.1 General
8.11.2 Test conditions
8.11.3 Recovery
8.11.4 Final inspection, measurements and requirements
8.12 Rapid change of temperature [Go to Page]
8.12.1 General
8.12.2 Initial measurement
8.12.3 Number of cycles
8.12.4 Recovery
8.12.5 Final inspection, measurements and requirements
8.13 Climatic sequence [Go to Page]
8.13.1 General
8.13.2 Initial measurement
8.13.3 Dry heat
8.13.4 Damp heat, cyclic, Test Db, first cycle
8.13.5 Cold
8.13.6 Damp heat, cyclic, Test Db, remaining cycles
8.13.7 Final inspection, measurements and requirements
8.14 Damp heat, steady state [Go to Page]
8.14.1 General
8.14.2 Initial measurement
8.14.3 Test conditions
8.14.4 Recovery
8.14.5 Final inspection, measurements and requirements
8.15 Endurance [Go to Page]
8.15.1 General
8.15.2 Initial measurement
8.15.3 Test conditions
8.15.4 Recovery
8.15.5 Final inspection, measurements and requirements
8.16 Robustness of terminations (only for capacitors with strip termination) [Go to Page]
8.16.1 General
8.16.2 Test conditions
8.16.3 Final inspection and requirements
8.17 Component solvent resistance (if required)
8.18 Solvent resistance of the marking (if required)
8.19 Accelerated damp heat, steady state (if required) [Go to Page]
8.19.1 General
8.19.2 Initial measurement
8.19.3 Conditioning
8.19.4 Recovery
8.19.5 Final measurements
Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Annex B (informative) Combination of temperature coefficient and tolerance for the reference temperature of 25 °C
Annex X (informative) Cross-reference for reference to IEC 60384-21:2011
Bibliography
Figures [Go to Page]
Figure 1 – Fault: crack or fissure
Figure 2 – Fault: crack or fissure
Figure 3 – Separation or delamination
Figure 4 – Exposed electrodes
Figure 5 – Principal faces
Figure 6 – Reflow temperature profile
Figure A.1 – Dimensions
Tables [Go to Page]
Table 1 – Preferred tolerances on nominal capacitance
Table 2 – Nominal temperature coefficient and tolerance
Table 3 – Combination of temperature coefficient and tolerance
Table 4 – Fixed sample size test plan for qualification approval – Assessment level EZ
Table 5 – Tests schedule for qualification approval
Table 6 – Lot-by-lot inspection
Table 7 – Periodic tests
Table 8 – Tangent of loss angle limits
Table 9 – Test voltages
Table 10 – Temperature cyclic drift limits
Table 11 – Reflow temperature profiles for Sn-Ag-Cu alloy
Table 12 – Maximum capacitance change
Table 13 – Maximum capacitance change
Table 14 – Number of damp heat cycles
Table 15 – Final inspection, measurements and requirements
Table 16 – Test conditions for damp heat, steady state
Table 17 – Final inspection, measurements and requirements
Table 18 – Endurance test conditions (UC = UR)
Table 19 – Endurance test conditions (UC ≠ UR)
Table 20 – Final inspection, measurements and requirements
Table 21 – Initial requirements
Table 22 – Conditioning
Table A.1 – Dimensions
Table B.1 – Combination of temperature coefficient and tolerance for the reference temperature of 25 °C
Table X.1 – Reference to IEC 60384-21 for clause/subclause
Table X.2 – Reference to IEC 60384-21 for figure/table
Français [Go to Page]
SOMMAIRE
AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Termes et définitions
4 Informations devant figurer dans une spécification particulière [Go to Page]
4.1 Généralités
4.2 Dessin d'encombrement et dimensions
4.3 Montage
4.4 Valeurs assignées et caractéristiques [Go to Page]
4.4.1 Généralités
4.4.2 Plage de capacités nominales
4.4.3 Caractéristiques particulières
4.4.4 Brasage
4.5 Marquage
5 Marquage [Go to Page]
5.1 Généralités
5.2 Informations relatives au marquage
5.3 Marquage sur le corps
5.4 Exigences relatives au marquage
5.5 Marquage de l'emballage
5.6 Marquage supplémentaire
6 Valeurs assignées et caractéristiques préférentielles [Go to Page]
6.1 Caractéristiques préférentielles
6.2 Valeurs assignées préférentielles [Go to Page]
6.2.1 Température assignée (TR)
6.2.2 Tension assignée (UR)
6.2.3 Tension de catégorie (UC)
6.2.4 Valeurs préférentielles de capacité nominale et valeurs de tolérance associées
6.2.5 Coefficient de température (α )
6.2.6 Dimensions
7 Procédures d'assurance de la qualité [Go to Page]
7.1 Etape initiale de fabrication
7.2 Modèles associables
7.3 Enregistrements certifiés de lots livrés
7.4 Homologation [Go to Page]
7.4.1 Généralités
7.4.2 Homologation fondée sur les procédures avec un nombre d'échantillons fixe
7.4.3 Essais
7.5 Contrôle de conformité de la qualité [Go to Page]
7.5.1 Formation des lots de contrôle
7.5.2 Programme d'essais
7.5.3 Livraison différée
7.5.4 Niveaux d'assurance
8 Procédures d'essais et de mesures [Go to Page]
8.1 Généralités
8.2 Séchage préliminaire
8.3 Conditions de mesure
8.4 Montage
8.5 Examen visuel et contrôle des dimensions [Go to Page]
8.5.1 Généralités
8.5.2 Examen visuel
8.5.3 Exigences
8.6 Essais électriques [Go to Page]
8.6.1 Capacité
8.6.2 Tangente de l'angle de perte (tan δ )
8.6.3 Résistance d'isolement
8.6.4 Tenue en tension
8.7 Coefficient de température (α ) et dérive cyclique de température [Go to Page]
8.7.1 Généralités
8.7.2 Séchage préliminaire
8.7.3 Conditions de mesure
8.7.4 Exigences
8.8 Essai de cisaillement
8.9 Essai de courbure du substrat [Go to Page]
8.9.1 Généralités
8.9.2 Mesure initiale
8.9.3 Contrôle final
8.10 Résistance à la chaleur de brasage [Go to Page]
8.10.1 Généralités
8.10.2 Mesure initiale
8.10.3 Conditions d'essai
8.10.4 Rétablissement
8.10.5 Exigences, mesures et contrôle final
8.11 Brasabilité [Go to Page]
8.11.1 Généralités
8.11.2 Conditions d'essai
8.11.3 Rétablissement
8.11.4 Exigences, mesures et contrôle final
8.12 Variations rapides de température [Go to Page]
8.12.1 Généralités
8.12.2 Mesure initiale
8.12.3 Nombre de cycles
8.12.4 Rétablissement
8.12.5 Exigences, mesures et contrôle final
8.13 Séquence climatique [Go to Page]
8.13.1 Généralités
8.13.2 Mesure initiale
8.13.3 Chaleur sèche
8.13.4 Chaleur humide, cyclique, Essai Db, premier cycle
8.13.5 Froid
8.13.6 Chaleur humide, cyclique, essai Db, cycles restants
8.13.7 Exigences, mesures et contrôle final
8.14 Chaleur humide, essai continu [Go to Page]
8.14.1 Généralités
8.14.2 Mesure initiale
8.14.3 Conditions d'essai
8.14.4 Rétablissement
8.14.5 Exigences, mesures et contrôle final
8.15 Endurance [Go to Page]
8.15.1 Généralités
8.15.2 Mesure initiale
8.15.3 Conditions d'essai
8.15.4 Rétablissement
8.15.5 Exigences, mesures et contrôle final
8.16 Robustesse des sorties (uniquement pour les condensateurs munis de sorties à lamelle) [Go to Page]
8.16.1 Généralités
8.16.2 Conditions d'essai
8.16.3 Exigences et contrôle final
8.17 Résistance au solvant des composants (si cela est exigé)
8.18 Résistance au solvant du marquage (si cela est exigé)
8.19 Chaleur humide, essai continu accéléré (si cela est exigé) [Go to Page]
8.19.1 Généralités
8.19.2 Mesure initiale
8.19.3 Conditionnement
8.19.4 Rétablissement
8.19.5 Mesures finales
Annexe A (normative) Recommandations pour la spécification et le codage des dimensions des condensateurs multicouches fixes à diélectriques en céramique pour montage en surface, Classe 1
Annexe B (informative) Combinaison du coefficient de température et de la tolérance pour la température de référence de 25 °C
Annexe X (informative) Correspondance des références avec l'IEC 60384-21:2011
Bibliographie
Figures [Go to Page]
Figure 1 – Défaut: craquelure ou fissure
Figure 2 – Défaut: craquelure ou fissure
Figure 3 – Séparation ou décollement interlaminaire
Figure 4 – Electrodes exposées
Figure 5 – Faces principales
Figure 6 – Profil de température de refusion
Figure A.1 – Dimensions
Tableaux [Go to Page]
Tableau 1 – Tolérances préférentielles sur la capacité nominale
Tableau 2 – Coefficient de température nominale et tolérance
Tableau 3 – Combinaisons de coefficient de température et de tolérance
Tableau 4 – Plan d'essais avec un nombre d'échantillons fixe pour homologation – Niveau d'assurance EZ
Tableau 5 – Programme d'essais pour homologation
Tableau 6 – Contrôle lot par lot
Tableau 7 – Essais périodiques
Tableau 8 – Limites de la tangente de l'angle de perte
Tableau 9 – Tensions d'essai
Tableau 10 – Limites de dérive après cycle thermique
Tableau 11 – Profils de température de refusion pour alliage Sn-Ag-Cu
Tableau 12 – Variation maximale de capacité
Tableau 13 – Variation maximale de capacité
Tableau 14 – Nombre de cycles de chaleur humide
Tableau 15 – Exigences, mesures et contrôle final
Tableau 16 – Conditions d'essai continu de chaleur humide
Tableau 17 – Exigences, mesures et contrôle final
Tableau 18 – Conditions d'essai d'endurance (UC = UR)
Tableau 19 – Conditions d'essai d'endurance (UC ≠ UR)
Tableau 20 – Exigences, mesures et contrôle final
Tableau 21 – Exigences initiales
Tableau 22 – Conditionnement
Tableau A.1 – Dimensions
Tableau B.1 – Combinaison du coefficient de température et de la tolérance pour la température de référence de 25 °C
Tableau X.1 – Référence à l'IEC 60384-21 pour les articles/paragraphes
Tableau X.2 – Référence à l'IEC 60384-21 pour les figures/tableaux [Go to Page]

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S+ IEC 60384-21 Ed. 3.0 en:2019 (Redline version) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1, 2019

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S+ IEC 60384-21 Ed. 3.0 en:2019 (Redline version) Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1, 2019

⨯To continue with accurate pricing,
please select your company type below: